UW SUS-nano-activating additive is a specialized product for the plating of SUS. The traditional process of SUS plating includes: degreasing, acid activation, Nickel pre-plating, Nickel plating, and then Gold/Tin plating.

However, the UW SUS-nano-activating additive can be simplified the traditional process. The removed of all Nickel process not only decreasing the defect rate of SUS plating, but also reducing the production cost.

UW SUS-nano-activating additive is RoHS/Halogen free qualified. We believe this product has a great contribution on electrochemistry industry.